MOSSETY-LESZCZAK, B.; OSTYŃSKA, P.; DUTKIEWICZ, M.; MACIEJEWSKI, H.; GALINA, H. Curing of epoxy resin epidian® 6 containing reactive organosilicon filler — a differential scanning calorimetry study. Polimery, [S. l.], v. 58, n. 3, p. 212-218, 2013. Disponível em: http://polimery.ichp.vot.pl/index.php/p/article/view/727. Acesso em: 25 apr. 2024.