Mossety-Leszczak, B., Ostyńska, P., Dutkiewicz, M., Maciejewski, H. and Galina, H. (2013) “Curing of epoxy resin epidian® 6 containing reactive organosilicon filler — a differential scanning calorimetry study”, Polimery, 58(3), pp. 212-218. Available at: http://polimery.ichp.vot.pl/index.php/p/article/view/727 (Accessed: 16April2024).