Mossety-Leszczak, B., P. Ostyńska, M. Dutkiewicz, H. Maciejewski, and H. Galina. “Curing of Epoxy Resin Epidian® 6 Containing Reactive Organosilicon Filler — a Differential Scanning Calorimetry Study”. Polimery 58, no. 3 (March 30, 2013): 212-218. Accessed April 22, 2024. http://polimery.ichp.vot.pl/index.php/p/article/view/727.