HAŁASA, E. Liquid epoxy resins for encapsulation of integrated circuits elements. Polimery, [S. l.], v. 49, n. 9, p. 595–601, 2022. Disponível em: https://polimery.ichp.vot.pl/index.php/p/article/view/1789. Acesso em: 21 nov. 2024.