Mossety-Leszczak, B., P. Ostyńska, M. Dutkiewicz, H. Maciejewski, and H. Galina. 2013. “Curing of Epoxy Resin Epidian® 6 Containing Reactive Organosilicon Filler — a Differential Scanning Calorimetry Study”. Polimery 58 (3):212-18. https://polimery.ichp.vot.pl/index.php/p/article/view/727.