Published : 2022-09-01

Deposition of thin films based on silica on polycarbonates by pulsed dielectric barier discharge

Abstract

The process of thin organo-silica film deposition on polycarbonate in pulsed dielectric barrier discharge was studied. Thin film was deposited from the gas mixture comprising helium, oxygen and tetraethoxysilane under atmospheric pressure without pre-heating of polycarbonate plate. Influences of process parameters, namely the current of single pulse of discharge, PC plate arrangement and position, and plasma-generating gas composition on the deposition rate were investigated. Deposition rate increased from 3.4 to 40.8 nm/min when the current of single pulse increased from 50 to 100 A. The presence of oxygen in plasma-generating gas was necessary to thin organosilicon film forming, but the excess of O2 concentration caused decreasing of film deposition rate, for example: deposition rate was 14.9 or 6.0 nm/min when concentration of O2 was changed from 5 to 20 % by vol. In the films, the following elementaly composition (Si, C, O, H) and morphology of deposited films were characterized.


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Opalińska, T., Ulejczyk, B., Karpiński, L., & Schmidt-Szałowski, K. (2022). Deposition of thin films based on silica on polycarbonates by pulsed dielectric barier discharge. Polimery, 49(4), 257–263. Retrieved from https://polimery.ichp.vot.pl/index.php/p/article/view/1748