Zastosowanie żywic epoksydowych w elektronice i optoelektronice. Cz. I. Właściwości mechaniczne i stabilność termiczna żywic epoksydowych stosowanych do hermeryzacji urządzeń elektronicznych

W. Mazela; P. Czub; J. Pielichowski

Published : 2022-09-01

Vol. 49 No. 4 (2004)

Application of epoxy resins in electronics and optoelectronics. Part 1. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices

W. Mazela P. Czub J. Pielichowski

Abstract

The problems concerning electronic circuitry encapsulation with epoxy resins (EP resins) were discussed in this literature review. Types of most important components of epoxy molding compounds (Table 1) as well as their functions in the epoxy systems and requirements concerning them were presented. In the encapsulated semiconductor structure (Fig. 1) an analysis of the spots of internal stresses occurrence and the reasons of them [equations (1) and (2)] causing the microcircuit system damage were presented. As well the current directions of research on new EP resins warranting the operational reliability of the integrated circuits produced recently, fulfilling the requirements of new technologies of electronic industry. There is also presented a review of modified epoxy molding compounds characterized with small values of flexural modulus and the same time as high as possible glass transition temperature allowing to keep small value of the coefficient of thermal expansion [scheme A and B, equation (3)]. Modification has been carried out by introducing of flexible domains or biphenyl segments [formula (1)] to EP matrix.

Keywords

żywice epoksydowe ; tłoczywa epoksydowe ; układy scalone ; hermetyzacja ; modyfikacja ; naprężenia wewnętrzne epoxy resins ; epoxy molding compounds ; integrated circuits ; encapsulation ; modification ; internal stresses

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Mazela, W., Czub, P., & Pielichowski, J. (2022). Application of epoxy resins in electronics and optoelectronics. Part 1. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices. Polimery, 49(4), 233–239. Retrieved from https://polimery.ichp.vot.pl/index.php/p/article/view/1745

References

Czub I’., Bończa-Tomaszewski Z.. Penczek P., Pielichowski„Chemia i technologia żywic epoksydo-wych", wyd. IV, WNT, Warszawa 2002.

2. Sinnadurai N.: Microelectwn. Retuib. 1996,36,1001.

3. Pielichowski J., Puszyński A.: „Technologia tworzyw sztucznych", wyd. V, WNT, Warszawa 1998.

4. Ellis B.: „Chemistry and Technology of Epoxy Resins", Chapman & Hall, Londyn 1994.

5. Lin C. H., Huang J. M„ Wang C. S,: Polymer 2002,43, 2959.

6. Rozdział P. „Tworzywa sztuczne w elektronice", WNT, Warszawa 1970.

7. Yoda N.: Polym. Adv. Tech i. 1997,8,215.

8. Liebert S.: Microclectron. Reliab. 2002,42,1939.

9. Fabrycy E., Królikowski W., Fidel G.: Polimery 1986, 31, 148.

10. Herard L.: Microelectron. Eng. 1999,49,17.

11. Lantz L„ Hwang S., Pecht .VI.: Microelectron, Reliab. 2002,42,1163.

12. Ho T. H„ Wang C. S.: J. Appl. Polym. Set 1994, 51, 2047.

13. Ho T. H„ Wang C. S.: Polymer 1996,37, 2733.

14. Shieh J. Y, Ho T. H, Wang C. S.: Angeut. Makromol. Chem. 1995,224,21.

15. Ho T. H„ Wang C. S.: Europ. Polym. J. 2001,37,267.

16. Pol. USA 6 194 491 (2000.

17. Pat. USA 5 364 893 (1994).

18. Rodriguez M. P., Shammas N. Y. A.: Microelectron Reliab. 2001,41,517.

19. Amagi M.: Finite Elements in Analysis and Design 1998,30,97.

20. Tai H. J., Chou H. L: Ear. Polym. J. 2000,36,2213.

21. Barrett 1.: Microelectron. Reliab, 1998, 38,1277.

22. Matsumoto A., Hasegata K., Fukuda A.: Polym. hit 1993,31,275.

23. Wang C. S., Lee M. C.: Polym. Bull. 1998,40, 623.

24. Pat. europejski 0 428 871 (1998).

25. Manzione L. T., Gillham j. K., McPherson C. A.: J. Appl. Polym. Sci. 1981,26,889.

26. Pat. niemiecki 3 130 708 (1983).

27. Verchere D., Sautereau H., Pascault ]. P., Moschiar 5. M., Ricardi C. C, Williams J. J.: J, Appl. Polym. Sci. 1990,41,467.

28. Verchere D„ Pascault J. P, Sautereau H., Moschiar S. M., Ricardi C. C, Williams J. J.: J. Appl. Polym. Sci, 1991,42,701.

29. Pat. LISA 5 334 662 (1994).

30. Pat. koreański 9 511 904 (1995).

31. Meister J. J.: „Polymer Modification", Marcel Dekker, INC, Nowy Jork 2000.

32. Pat USA 5075 379 (1991).

33. Manzione L. T, Gillham J. K.: J. Appl. Polym. Sci. 1981, 26,889.

34. Pat. USA 5 919 844 (1999).

35. Ho T. H., Wang C. S.: J. Appl, Polym. Sci. 1993,53,477

36. Shieh J. Y., Ho T. H„ Wang C. S.: Angew. Makromol. Chau. 1997,245,125.

37. Lin L. L., Ho T. H., Wang C. S.: Polymer 1997,38, 1997.

38. Wang C. S„ Lee M. C.t Polym. Bull. 1998,40,623.

39. Ochi M., Yamashita K., Yoshizumi M., Shimbo .VI.: J. Appl. Polym. Sci. 1989,38,789.

40. Shiraishi T„ Motobe H., Ochi M., Nakanishi Y„ Konishi I.: Polymer 1992,33,2975.

41. Wang C. S., Berman J. R., Walker L. L., Mendoza A.: J. Appl. Polym. Sci. 1991,43,1315.

42. Pat. USA 5 360 837 (1994).

43. Pat. USA 5 298 548 (1994).

44. Pat. USA 5 567 749 (1996).

45. Pat. USA 6 358 629 (2001).

46. Zglosz. pat. USA 146 565 (2002).

47. Pat. USA 6 162 878 (2000).

48. Pat. USA 6 194491 (2001).

49. Pat. USA 6 358 629 (2002).

50. Zglosz. pat. USA 025 431 (2002).

51. Pat. USA 6 015 872 (2000).

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W. Mazela

Affiliation
Politechnika Krakowska, Samodzielna Katedra Chemii i Technologii Tworzyw Sztucznych, ul. Warszawska 24, 31-155 Kraków

P. Czub pczub@usk.pk.edu.pl

Affiliation
Politechnika Krakowska, Samodzielna Katedra Chemii i Technologii Tworzyw Sztucznych, ul. Warszawska 24, 31-155 Kraków

J. Pielichowski

Affiliation
Politechnika Krakowska, Samodzielna Katedra Chemii i Technologii Tworzyw Sztucznych, ul. Warszawska 24, 31-155 Kraków